PlayStation 5 getting the third revision. Codename “CFI-1202” or PS5 1200 series, the last two did not have much of a change except the heat sink which got smaller in the 1100 series, and some minor tweaks in the console.
The latest change is a direct change of SoC manufactured using TSMC 6nm process technology. Those who are not familiar with the term of SoC term used System-on-a-Chip. it got a new ‘6nm Oberon Plus’ as compared to the first mode which was using 7nm, ‘Oberon’. It is the same design and there is not much of a change in the processor configuration as it is still using Zen2 compute and RDNA 2 graphics architectures stay the same. But, it got a new mainboard, better cooling, and a lighter heat sink. As per details, this is only available right now in Australia. But it will soon follow other regions.
As both SoC are identical performance wise but the main change chip just got a bit smaller, around 260 mm² Oberon Plus compared to the original 300 mm² Oberon. With this change PS5, 1200 series will need less power and a less demanding cooling solution. As per power changes it uses 10% less power than compared to its predecessor 1100 series. The main benefit for Sony and AMD with this change is that it can produce more chips with a single wafer. So, this will reduce another 12% cost of production for them. As per reports, Xbox will be adopting this SoC change very soon.
